SOT23 - NXP Semiconductors
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related...
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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related...
Package Information : SOT-23封裝尺寸 ... Revison: A 更多資訊歡迎參觀公司網頁www.leadpower-semi.com
SOT和TSOT只是高度上的不同,PCB封装通用
0.1 TYP 0∘ 8∘ Dimensions in Inches Min Max 0.039 0.049 0.000 0.004 0.039 0.045 0.012 0.022 0.003 0.008 0.106 0.122 0.047 0.071
Jun 29, 2025 · 本文档提供了SOT-23封装的尺寸信息,包括各个尺寸的公差和推荐焊盘布局。文档中详细列出了SOT-23封装的各个尺寸参数,如A、A1、A2、b、c、D、E、E1、e、e1、L、L1和θ,并给出了相应的
On this page you can find the dimensions and packing method for Toshiba Semiconductor's SOT23 package.
SOT23是一种小型表面贴装封装形式,属于SOP系列封装,主要用于三极管、二极管等半导体器件的塑料封装。其典型特征包括引脚间距0.95mm、紧凑尺寸(宽度分为1.3mm和1.6mm两种类型)。根据引脚数量不同,存在SOT23-3、SOT23-5、SOT23-6等多种变体,可适应不同功能需求。在PCB布局中,该封装因占用面积小 ...